Aim FF35 Underfill (10 Units)

4.3 (15 items)

Limited Time Sale

Until the end

New $90.00 (tax included) Number of stocks: 1

Used $45.00 (tax included) New Arrivals and Restocks Number in stock: 1

$45.00 cheaper than the new price!!

Free shipping for purchases over $99 ( Details )
Free cash-on-delivery fees for purchases over $99

See all stores

Please note that the sales price and tax displayed may differ between online and in-store. Also, the product may be out of stock in-store.

New $90.00

Management number	204120154	Release Date	2025/11/05	List Price	$45.00	Model Number	204120154
Category	Brands A–C

Underfill FF35 is a low surface tension, one component epoxy resin designed for use as a capillary flow underfill for flip chip, CSP, BGA and uBGA assemblies. Underfill FF35 offers excellent capillary action for flat, fast and complete spread. Faster throughput and higher yields are achieved through excellent capillary action, faster flow characteristics and rapid cure speeds.

Excellent Capillary Function for Fast Reflow Compatible with No-Clean Flux Residues 25%-35% Faster flow Reworkable at 120° C Good Storage Properties No Voiding .
TDS
MSDS